The EC360® PLATINUM SOFT series presents the high-end variant of high-performance thermal pads. The pads have best thermal conductivity of 16.6 W/mK, more than high-end thermal pastes and are suitable for a variety of applications.

This extra-soft variant with a low hardness of 65 Shore 00 has a putty-like consistency and is therefore highly flexible. Under pressure they will deform and adapt permanently to the surface they are applied to and will not spring back into their original shape. Examples of applications are cooling of CPUs
and GPUs (that are cooled by thermal pads), memory chips and other electrical components.

They perform particularly well for water cooling systems and are easy to use. The pads are not adhesive, but stick a little, so they can be easily positioned. It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.

Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming to the perfect size for any surface.

Types and Configurations

Thickness	Available sizes
0.5 mm / 0.02 inches	50x50 mm, 100x100 mm, 200x200 mm
1.0 mm / 0.04 inches	50x50 mm, 100x100 mm, 200x200 mm
1.5 mm / 0.06 inches	50x50 mm, 100x100 mm, 200x200 mm
2.0 mm / 0.08 inches	50x50 mm, 100x100 mm, 200x200 mm

Technical Properties

Properties	Unit	Value	Test method
Color	-	grey	visual
Thermal Conductivity	W/mk	16.6	ASTM D 5470
Specific Gravity	g / cm^3	3.6	ASTM D 792
Hardness	Shore 00	65	ASTM D 2240
Elongation	%	20	ASTM D 412
Volume Impedance	Ohm-cm	5.0*10¹⁴	ASTM D 257
Breakdown Voltage	kV/mm	5.0	ASTM D 149
Usable Temperatures	°C	-50 - 150	EN 344
Flame Rating	-	VO	UL 94

EC360® PLATINUM SOFT 50x50MM

EC360® PLATINUM SOFT 100x100MM

Datasheets