EC360® NON SILICONE Thermal Pad

The EC360® NON SILICONE series presents silicone-free thermal conductive gap fillers with a superior price-performance ratio. Featuring a high thermal conductivity of 5.0 W/mK, these materials are ideal for applications in hard disks, optical communication, high-end industrial and medical electronics, automotive engine control equipment, and specialized telecommunications hardware. The EC360® NON SILICONE series is characterized by its very soft and highly compressible nature, natural tackiness, and excellent electrical isolation properties. These gap fillers are easy to assemble and provide reliable thermal management solutions for CPUs, heat sinks, memory modules, LED lighting, LCD-TVs, military electronics, power supplies, telecom services, wireless instruments, and automotive control services. Composed of filled acrylic elastomer, they exhibit a hardness of 60 Shore 00.

Types and Configurations

Thickness*	Available sizes*
0.5 mm	50×50 mm, 100×100 mm, 200×200 mm
1.0 mm	50×50 mm, 100×100 mm, 200×200 mm
1.0 mm	50×50 mm, 100×100 mm, 200×200 mm
2.0 mm	50×50 mm, 100×100 mm, 200×200 mm
2.5 mm	50×50 mm, 100×100 mm, 200×200 mm
3.0 mm	50×50 mm, 100×100 mm, 200×200 mm
4.0 mm	50×50 mm, 100×100 mm, 200×200 mm
5.0 mm	50×50 mm, 100×100 mm, 200×200 mm

* Custom configurations are available upon request, for worldwide industrial inquiries please contact us at: sales@extremecool360.com

Technical Properties

Properties	Unit	Value	Test method
Color	–	Gray	Visual
Thermal Conductivity	W/mK	5.0	ASTM D5470
Hardness	Shore 00	60	ASTM D2240
Specific Gravity	g/cm³	3.3	ASTM D792
Temperature Range	°C	-40 – 125	–
Breakdown Voltage	V/mm	>8000	ASTM D149
Flame Rating	–	V-0	UL 94
Dielectric Constant	MHz	12.6	ASTM D150
Volume Resistivity	ohm-cm	2.1*10^13	ASTM D257
Tensile Strength	Psi	32	ASTM D412

Gallery

Certificates & Datasheets