The EC360® GREEN series presents the low-cost variant of our all-round silicone-based thermal pads. The thermal pads feature a balanced thermal conductivity of 2.5 W/mK and are suitable for a variety of applications.

Possible applications include RAM chips, integrated circuits and other electrical components. The pads have a rubber like consistency, which means that they will deform under pressure and spring back into their original shape. The slight adhesion of the pads allows for easy positioning.

It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.

Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming pads to the perfect size for any surface.

Types and Configurations

Thickness	Available sizes
0.5 mm / 0.02 inches	50x50 mm, 100x100 mm, 200x200 mm
1.0 mm / 0.04 inches	50x50 mm, 100x100 mm, 200x200 mm
1.5 mm / 0.06 inches	50x50 mm, 100x100 mm, 200x200 mm
2.0 mm / 0.08 inches	50x50 mm, 100x100 mm, 200x200 mm
3.0 mm / 0.12 inches	50x50 mm, 100x100 mm, 200x200 mm
4.0 mm / 0.16 inches	50x50 mm, 100x100 mm, 200x200 mm
5.0 mm / 0.20 inches	50x50 mm, 100x100 mm, 200x200 mm

Technical Properties

Properties	Unit	Value	Test method
Color	-	green	visual
Thermal Conductivity	W/mk	2,5	ASTM D 5470
Specific Gravity	g / cm^3	1,6	ASTM D 792
Hardness	Shore C	40	ASTM D 2240
Tensile Strength	psi	5,88	ASTM D 412
Elongation	%	12	ASTM D 412
Volume Impedance	Ohm-cm	1,0 x 10¹¹	ASTM D 257
Breakdown Voltage	kV/mm	4,0	ASTM D 149
Usable Temperatures	°C	-40 - 240	EN 344
Flame Rating	-	VO	UL 94

EC360® GREEN 50x50MM

EC360® GREEN 100x100MM

EC360® GREEN 200x200MM

Datasheets