The EC360® GOLD series presents the intermediate variant of high-performance thermal pads, which are on eye-level with premium thermal paste. The pads have an extraordinary thermal conductivity of 14.5 W/mK and are suitable for a variety of applications including CPUs and GPUs (that are cooled by thermal pads), memory chips and other electrical components.

They perform particularly well for water cooling systems, as the pads have a putty like consistency, which means that they will deform and adapt permanently to the surface they are applied to and will not spring back into their original shape.

The pads are not adhesive, but stick a little, so they can be easily positioned. It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.

Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming to the perfect size for any surface.

Types and Configurations

Thickness	Available sizes
0.5 mm / 0.02 inches	50x50 mm, 100x100 mm, 200x200 mm
1.0 mm / 0.04 inches	50x50 mm, 100x100 mm, 200x200 mm
1.5 mm / 0.06 inches	50x50 mm, 100x100 mm, 200x200 mm
2.0 mm / 0.08 inches	50x50 mm, 100x100 mm, 200x200 mm
2.5 mm / 0.10 inches	50x50 mm, 100x100 mm, 200x200 mm
3.0 mm / 0.12 inches	50x50 mm, 100x100 mm, 200x200 mm

Technical Properties

Properties	Unit	Value	Test method
Color	-	red	visual
Thermal Conductivity	W/mk	14.5	ASTM D 5470
Specific Gravity	g / cm^3	2.6	ASTM D 792
Hardness	Shore C	40	ASTM D 2240
Elongation	kg/cm 2 Pa	55 5.9 x 10⁹	ASTM D 412 ASTM D 412
Volume Impedance	Ohm-cm	2.9 x 10¹¹	ASTM D 257
Breakdown Voltage	kV/mm	6.0	ASTM D 257
Usable Temperatures	°C	-40 - 220	EN 344
Flame Rating	-	VO	UL 94

EC360® GOLD 50x50MM

EC360® GOLD 100x100MM

Datasheets