Description
Designed as an all-round thermal paste with the best possible price-performance ratio, as well as a high thermal conductivity, the EC360® EMERALD series is the ideal thermal paste for gaming PCs and sophisticated industrial cooling systems.
A special compound, characterized by outstanding stability and an excellent thermal conductivity of 9 W/mK, make this thermal paste one of the most effective thermal conductors. Its good consistency makes it easy to spread and install. Ideal for use with high-performance CPUs and GPUs.
It is long-lasting: low bleed, non-flowing and low evaporation mean it will stay in place and not dry out over time. At the same time, it is not electrically conductive, which allows a safe application.
Specs
Types and Configuration
Type | Available sizes |
---|---|
Tube | 4 g, 20 g |
Technical Properties
Properties | Unit | Value | Test method |
---|---|---|---|
Color | - | grey | visual |
Thermal Conductivity | W/mk | 9.0 | ROCT 8.140-82 |
Thermal Impedance | °C-in/W | 0.14 | ROCT 8.140-82 |
Specific Gravity | g / cm3 | 1.8 | ASTM D 1475 |
Evaporation (200°C/24h) | % | 0.001 | FED STD 791 |
Dissipation Factor | 100 Hz | 0.005 | ASTM D 150 |
Viscosity | cP | 68 | GB T-10247 |
Dielectric Constant | 100 Hz | 4.0 | ASTM D 150 |
Usable Temperatures | °C | -55 - 220 | EN 344 |
Gallery