The EC360® DIAMOND series means High Performance. A compound of highly thermal conductive material, enables an outstandingly high thermal conductivity of 11W/mK.

Engineered with a focus on high performance, it is the perfect choice for cooling GPUs and CPUs in extreme cooling scenarios, like overclocking. In short, it ensures efficient dissipation of heat in any use case.

At the same time, it can be safely applied, it is not electrically conductive, remains easy to spread and is highly durable. Low bleed, non-flowing and low evaporation mean it is long-lasting, will stay in place and not dry out over time.

Types and Configuration

Type	Available sizes
Tube	1 g, 4 g, 20 g

Technical Properties

Properties	Unit	Value	Test method
Color	-	grey	visual
Thermal Conductivity	W/mk	11	ASTM D 5470
Thermal Resistance	°C-in2/W	0.0013	ASTM D 5470
Specific Gravity	g / cm^3	3.2	ASTM D 792
Evaporation (150°/24h)	%	0.15	FED STD 791
Volume Impedance	Ohm-cm	3.0 x10¹³	ASTM D 257
Viscosity	cP	15000	-
Dielectric Constant	1Mhz	3.0	ASTM D 150
Usable Temperatures	°C	-30 - 240	EN 244